Integrated circuit device having reduced bow and method for making same

An integrated circuit device comprising:

• a semiconductor component coupled with a lead frame, the semiconductor component and at least one portion adjacent to the semiconductor component defining a die area, the die area having a die area surface;
• an integrated circuit package encompassing at least a portion of the semiconductor component, the package having a first surface and a second surface, and side surfaces;
• the integrated circuit package having a parting line disposed on the side surfaces, where the parting line is offset toward a second surface of the package;
• and
• at least a first area defined by the first surface without the die area, the first area having a first area surface, where the first area surface is recessed away from the die area surface.

An integrated circuit device comprising:

• a semiconductor component coupled with a lead frame, the semiconductor component and at least one portion adjacent to the semiconductor component defining a die area, the die area having a die area surface;
• an integrated circuit package encompassing at least a portion of the semiconductor component, the package having a first surface and a second surface, and side surfaces, the side surfaces including a first side surface opposite a second side surface;
• the integrated circuit package having a parting line disposed on the side surfaces, where the parting line is offset toward a second surface of the package;
• at least a first area and a second area defined by the first surface without the die area, the die area disposed between the first area and the second area, the first area and the second area each extending from the first side surface to the second side surface;
• and
• the first area having a first area surface, the second area having a second area surface, where the first area surface and the second area surface are recessed away from the die area surface.

A method comprising:

• coupling a semiconductor device to a leadframe;
• overmolding a package on at least a portion of the semiconductor device and over a portion of the leadframe and forming a parting line, where the package has a first surface and a second surface, and side surfaces, and the parting line is offset toward a second surface of the package;
• and
• forming at least one recess in the first surface of the package.

A method comprising:

• coupling a semiconductor device to a leadframe;
• overmolding a package on at least a portion of the semiconductor device and over a portion of the leadframe and forming a parting line, where the package has a first surface and a second surface, and side surfaces, and the parting line is offset toward a second surface of the package;
• and
• wherein forming the first surface includes forming a non-planar surface and forming the second surface includes forming a uniform planar surface.

A method comprising:

• coupling a semiconductor device to a leadframe;
• overmolding a package on at least a portion of the semiconductor device and over a portion of the leadframe and forming a parting line, where the package has a first surface and a second surface, and side surfaces, and the parting line is formed along the side surfaces and the parting line is offset toward a second surface of the package;
• forming a die area having a die area surface, where the semiconductor device and at least one portion adjacent to the semiconductor device define the die area;
• recessing at least a first area defined by the first surface without the die area, wherein recessing the first area includes recessing the first area away from the die area surface.

A method comprising:

• coupling at least one semiconductor device to a leadframe;
• overmolding a package on at least a portion of the at least one semiconductor device and over a portion of the leadframe and forming a parting line, where the package has a first surface and a second surface, and side surfaces, and the parting line is offset toward a second surface of the package;
• wherein the parting line and the first surface define a first portion of the package, the parting line and the second surface define a second portion of the package, the second portion having a second volume of material, and overmolding the package includes forming the first volume the substantially the same as the second volume;
• and
• forming at least one recess in the first surface of the package.