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US 2003/0201542 A1Published application
Flexible lead surface-mount semiconductor package
OwnerJiahn-Chang Wuinventor
Life of this patent
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Abstract
A diode chip is mounted on two bottom metal leads of a surface-mount package through two flexible links. The links are zigzag cantilevers attached to the metallic plates. The cantilevers serve as springs to support the device and to cushion any temperature stress or bending stress so as not to damage the connection between the device and the metallic leads.
Claims10
A surface mount semiconductor device package, comprising;
- a semiconductor device;
- a glue for sealing said semiconductor device, and
- at least two metallic plates on which said semiconductor device is mounted,
- said metallic plates having bottom contacts for surface mounting to a motherboard, and zigzag cantilevers outside the chip area of said semiconductor device for strengthening said metallic plates imbedded in said glue and for making connections to said semiconductor device.
1 more element
Dependencies are inferred from the claim text.