Compliant, solderable input/output bump structures

A circuit structure comprising:

• a support surface having at least one contact pad disposed thereon;
• a dielectric layer disposed over said support layer, said dielectric layer having at least one via opening therein exposing said at least one contact pad;
• a metal layer disposed over said dielectric layer and extending into said at least one via opening to electrically contact said at least one contact pad;
• and
• at least one mushroom-shaped conductive bump disposed above said dielectric layer and electrically coupling to said metal layer, wherein each mushroom-shaped conductive bump has a stem portion and a top portion, said stem portion electrically coupling said top portion to said metal layer.

A circuit structure comprising:

• an integrated circuit module having an upper surface with a via opening therein to an underlying metal layer;
• an interconnection bump offset from said via opening to facilitate electrical coupling of said integrated circuit module to a-circuit structure;
• and
• a metal layer disposed over said upper surface of said integrated circuit module extending into said via opening to electrically contact said underlying metallization and extending between said via opening to said interconnection bump to electrically connect said interconnection bump to said underlying metallization of said integrated circuit module.

A method of fabricating a circuit structure, said method comprising:

• providing a support surface having at least one contact pad disposed thereon;
• disposing a dielectric layer over said support surface, and forming at least one via opening in said dielectric layer to expose said at least one contact pad;
• providing at least one non-conductive compliant bump over said dielectric layer;
• and
• forming at least one metal layer which includes metal over a surface of said at least one non-conductive compliant bump, and which facilitates electrical coupling of said metal over said surface of said at least one non-conductive compliant bump with said at least one contact pad of said support surface.

A method of fabricating a circuit structure, said method comprising:

• providing a support surface having at least one contact pad formed thereon;
• disposing a dielectric layer above said support surface, and forming at least one via opening in said dielectric layer to expose said at least one contact pad;
• disposing a metal layer over said dielectric layer and extending into said at least one via opening to electrically contact said at least one contact pad;
• and
• providing at least one mushroom-shaped conductive bump above said dielectric layer and electrically coupling to said metal layer, wherein each mushroom-shaped conductive bump has a stem portion and a top portion, said stem portion electrically coupling said top portion to said metal layer.