Connection device and method for producing the same
AssigneeInfineon Technologies AG
InventorEdmund Riedl
Life of this patent
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Abstract
A connection device for a circuitry device connects a circuitry unit with a contact device to thermo-mechanically uncouple the circuitry unit and the contact device by forming the connection device as a metallic section and/or an alloy section having a buffer region, an intermediate region, and a connection region. The buffer region is of silver, the intermediate region (14) is of a silver-tin alloy region, and the connection region (16) is of an intermetallic substrate and, in particular, of an intermetallic tin-substrate.
Claims39
A connection device for at least one of mechanically and electrically connecting at least one circuitry unit of a circuitry device with at least one contact device and to thereby thermo-mechanically uncouple the circuitry unit and the contact device, the connection device comprising:
- a preformed section of at least one of the group consisting of a metallic section and an alloy section, said preformed section having:
- a buffer region including silver;
- an intermediate region including a silver-tin alloy;
- and
- a connection region including an intermetallic substrate of at least one of:
- tin;
- silver;
- a metal able to form an intermetallic compound with at least one of tin and silver;
- and
- a metal material able to form an intermetallic compound with at least one of tin and silver;
- and
- said preformed section disposed at one of the group consisting of the circuitry unit and the contact device.
A method for producing a circuitry connection device, which comprises:
- at least one of mechanically and electrically connecting at least one circuitry unit of a circuitry device with at least one contact device to thermo-mechanically uncouple the circuitry unit and the contact device by:
- providing a metal/alloy portion between respective predetermined surface portions of the circuitry unit and the contact device, the metal/alloy portion having:
- a first section including silver and facing the surface portion of the circuitry unit;
- a second section including a silver-tin alloy and facing the surface portion of the contact device;
- and
- said first and second sections facing each other;
- heating at least one of:
- the metal/alloy portion;
- and
- at least parts of the first and second surface portions,
- above a eutectic melting temperature of the silver-tin alloy to form:
- a buffer region including silver;
- an intermediate region with a silver-tin alloy region;
- and
- a connecting region at the contact device including an intermetallic substrate of at least one of:
- tin;
- silver;
- a metal able to form an intermetallic compound with at least one of tin and silver;
- and
- a metal material able to form an intermetallic compound with at least one of tin and silver.
Dependencies are inferred from the claim text.