Package stacked semiconductor device having pin linking means
AssigneeBarun Electronics Co., Ltd.
InventorsDo-Soo Jeong, Wan-Gyun Choi
Life of this patent
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Abstract
A package stacked semiconductor device includes a plurality of pin linking means for electrically connecting at least one of control signal pins of one package to its neighbor NC pin of the same package. Either of the control signal pin or the neighbor NC pin, which are electrically interconnected, is electrically connected to the corresponding pin of the next package.
Claims16
A semiconductor device comprising a plurality of vertically stacked semiconductor chip packages, each of said packages comprising a semiconductor chip;
- a plurality of electrode pads on the chip at its active surface;
- and a plurality of conductive leads for electrically connecting the electrode pads to external world;
- each of said conductive leads including power pins for power signal for the semiconductor chip;
- data pins for inputting and outputting data to and from the semiconductor chip;
- control signal pins;
- and no connection (NC) pins;
- wherein said device comprises a plurality of pin connection parts for connecting the conductive leads of one package (“first package”) to the respective corresponding conductive leads of the next stacked package (“second package”);
- and
- wherein said first package comprises at least one control signal (“coupling CS pin”) and at least one NC pin (“coupling NC pin”), which are next to each other;
- said coupling CS pin being coupled to said coupling NC pin in such a way that they are electrically connected;
- and only one of said coupling CS pin or said coupling NC pin being electrically connected to the corresponding pin of the second package.
A semiconductor device comprising a plurality of vertically stacked semiconductor chip packages, each of said packages comprising a semiconductor chip;
- a plurality of electrode pads on the chip at its active surface;
- a plurality of conductive leads for electrically connecting the electrode pads to external world;
- and a package body for encapsulating the semiconductor chip and a part of the conductive leads;
- each of said conductive leads including power pins for power signal for the semiconductor chip;
- data pins for inputting and outputting data to and from the semiconductor chip;
- control signal pins;
- and no connection (NC) pins;
- wherein said device comprises a plurality of pin connection parts for connecting the conductive leads of one package (“first package”) to the respective corresponding conductive leads of the next stacked package (“second package”);
- wherein said first package comprises at least one control signal (“coupling CS pin”), which is not connected to the corresponding pin of the second package, and at least one NC pin (“coupling NC pin”) which is next to the coupling CS pin;
- said coupling CS pin being coupled to said coupling NC pin in such a way that they are electrically connected;
- and said coupling CS pin being electrically connected to an NC of the second package, which corresponds to said coupling NC pin.
Dependencies are inferred from the claim text.