US 2003/0201528 A1 · Flip-chip die and flip-chip package substrate

Abstract

A flip-chip die and a flip-chip package substrate. The flip-chip die has an active surface containing a plurality of core power/ground pads, at least one signal pad rings, at least one power pad rings and at least one ground pad rings. The core power/ground pads are located in the central region of the die while the die pad rings are arranged concentrically just outside the central power/ground pad occupied region. The uppermost layer of the flip-chip package substrate has a plurality of bump pads that correspond to the die pads on the die. Non-signal bump pad rings may also form outside the signal bump pad ring. Pairs of power trace or ground trace may also form on the sides of a signal trace in any one of the wiring layers within the flip-chip package substrate to serve as guard traces for the signal trace.

Claims25

Dependent claims

A flip-chip die having an active surface with a plurality of core power/ground pads, at least one signal pad ring, at least one power pad ring and at least one ground pad ring thereon, wherein the core power/ground pads are located in the central region of the die while the signal pad ring, the power pad ring and the ground pad ring are located outside the central power/ground pad region but concentric to the central power/ground pad region.

Dependencies are inferred from the claim text.

Flip-chip die and flip-chip package substrate

Life of this patent

Flip-chip die and flip-chip package substrate

Life of this patent

Abstract

Claims25