Semiconductor device and method of manufacturing same
AssigneeOki Electric Industry Co., Ltd.
InventorMitsuya Ohie
Life of this patent
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Abstract
Pad electrodes 115 for connection to leads 9 and pad electrodes 125 for an internal interface are provided over a main surface of an LSI chip 103. The pad electrodes 115 of the LSI chip 113 and the pad electrodes 125 both placed over the main surface thereof are respectively electrically connected to one another by wires 117, whereby some of circuits required as for a system LSI, which are not included in the LSI chip 103, are placed over the LSI chip 113 to implement a desired function used as for the system LSI by the two LSI chips. Thus, the system LSI is easily implemented by a semiconductor device wherein a plurality of LSI chips are sealed with a resin.
Claims41
A semiconductor device, comprising:
- a first semiconductor element;
- and
- a second semiconductor element, said first and second semiconductor elements being sealed with a resin;
- and
- said first semiconductor element including,
- a plurality of first pad electrodes and a plurality of second pad electrodes placed over a main surface of said first semiconductor element, said plurality of first pad electrodes being respectively electrically connected to any of a plurality of circuits provided in said first semiconductor element and being electrically connected to corresponding ones of a plurality of terminals for connection to the outside, said plurality of second pad electrodes being respectively electrically connected to any of the plurality of circuits provided in said first semiconductor element;
- and
- said second semiconductor element including,
- a plurality of third pad electrodes placed over a main surface of said second semiconductor element, said third pad electrodes being respectively electrically connected to circuits provided in said second semiconductor element and being electrically connected to corresponding ones of said second pad electrodes;
- and
- said first semiconductor element executing a predetermined function by using the circuits provided in said second semiconductor element.
A method of manufacturing a semiconductor device wherein first and second semiconductor elements different in performance are sealed with a resin, comprising the following steps:
- a step for determining the second semiconductor element, wherein one capable of implementing a desired function in cooperation with the first semiconductor element, of a plurality of semiconductor elements respectively having different performance, is selected as the second semiconductor element;
- a step for electrically connecting the first and second semiconductor elements to each other, wherein said first semiconductor element has a plurality of first pad electrodes and a plurality of second pad electrodes placed over a main surface of said first semiconductor element, said first pad electrodes are used for electrically connecting to their corresponding ones of a plurality of terminals for connection to the outside, and electrical connections of said first semiconductor element to said second semiconductor element are carried out by using the plurality of second pad electrodes;
- and
- a step for sealing the first and second semiconductor elements electrically connected to each other with a resin.
A method of manufacturing a semiconductor device wherein first and second semiconductor elements are sealed with a resin and a desired function is implemented by using the semiconductor elements, comprising the following steps of:
- providing all the remaining components of components necessary to implement the desired function except for some thereof so as to be capable of operation with respect to the first semiconductor element for the purpose of implementing the desired function;
- providing the second semiconductor element with some components non-provided for the first semiconductor element;
- and
- electrically connecting the components between the semiconductor elements so as to allow the transfer of signals between these two semiconductor elements.
Dependencies are inferred from the claim text.