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US 2003/0201524 A1Published application
Tape automated bonding with strip carrier frame assembly
AssigneeIntel Corporation
InventorsYukihiro Murakami, Kinya Ichikawa
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Abstract
In one embodiment of the invention, a die is bonded on a strip carrier frame having a carrier alignment landmark. A tape automated bonding (TAB) strip having a TAB alignment landmark is aligned with the strip carrier frame. The TAB strip is bonded to the strip carrier frame to form a bonded unit.
Claims21
A method comprising:
- bonding a die on a strip carrier frame, the strip carrier frame having a carrier alignment landmark;
- aligning a tape automated bonding (TAB) strip with the strip carrier frame, the TAB strip having a TAB alignment landmark;
- and
- bonding the TAB strip to the strip carrier frame to form a bonded unit.
1 more element
A package assembly comprising:
- a strip carrier frame having a carrier alignment landmark;
- a die bonded to the strip carrier frame;
- and
- a first portion of a TAB strip bonded to the strip carrier frame to form a bonded unit, the TAB strip having a TAB alignment landmark, the TAB strip and the strip carrier being aligned using the TAB and carrier alignment landmarks.
1 more element
A device comprising:
- a carrier;
- a die bonded to the carrier at a die area via a first adhesive;
- and
- a first portion of a tape automated bonding (TAB) strip bonded to the carrier at a peripheral area via a second adhesive, the first portion having first inner leads bonded to the die at inner lead bond (ILB) pads, the first inner leads corresponding to fan-out traces.
1 more element
Dependencies are inferred from the claim text.