Semiconductor device having improved alignment of an electrode terminal on a semiconductor chip and a conductor coupled to the electrode terminal
AssigneeHitachi, Ltd.
InventorMitsuo Usami
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Abstract
A semiconductor device manufacturing method is used for packaging a thin semiconductor chip in an economical manner. A semiconductor chip having one electrode terminal, a first member having a first conductor on its surface, and a second member having a second conductor on its surface are prepared. The first and second members are positioned such that the first and second conductors face each other, and the semiconductor chip is held between the members. In this arrangement, one of the first and second conductors is in electrical contact with the first electrode.
Claims15
A semiconductor device manufacturing method comprising the steps of:
- preparing a semiconductor chip having one electrode terminal, a first member having a first conductor on its surface, and a second member having a second conductor on its surface;
- and
- positioning said first and second members such that said first and second conductors face to each other, and holding said semiconductor chip between said members, thereby bringing said first or second conductor into electrical contact with said one electrode terminal.
A semiconductor device wherein, upon establishment of electrical connection, between one electrode terminal of a semiconductor chip having an approximately rectangular or square plane shape and a first conductor member, by aligning said first conductor member with said first conductor member, said one electrode includes a pair of electrode terminals such that electrical connection can be made in a case where said semiconductor chip is rotated 90° and in a case where said semiconductor chip is not rotated, and wherein said semiconductor chip and said first conductor member are electrically connected with each other.
A semiconductor device manufacturing method comprising the steps of:
- upon establishment of electrical connection between one electrode terminal of a semiconductor chip having an approximately rectangular or square plane shape and a first conductor member, by aligning said first conductor member with said first conductor member, aligning said semiconductor chip by setting said semiconductor chip in a member having a groove or hole which can accommodate said semiconductor chip;
- and
- aligning said semiconductor chip with said first conductor member including a pair of electrode terminals such that electrical connection can be made in a case where said semiconductor chip is rotated 90° and in a case where said semiconductor chip is not rotated, thereby electrically connecting said semiconductor chip with said first conductor member.
Dependencies are inferred from the claim text.