Structure and method of forming a multiple leadframe semiconductor device
AssigneeSemiconductor Components Industries, LLC
InventorsJames H. Knapp, Stephen C. St. Germain
Life of this patent
Estimating the term…
Abstract
A semiconductor device (20) has a first leadframe (200) with a first semiconductor die (70) electrically coupled to one of its leads. A second semiconductor die (130) is mounted to a second leadframe (300) that has a first lead (35, 150) electrically coupled to the second semiconductor die and a second lead (30, 35) mounted to the lead of the first leadframe.
Claims38
A semiconductor device 20, comprising:
- a first leadframe 200;
- a first semiconductor die 70 electrically coupled to a lead 40,80,90 of the first leadframe;
- a second semiconductor die 130;
- and
- a second leadframe 300 having a first lead 150,140 35 for electrically coupling to the second semiconductor die and a second lead 35,30 for mounting to the lead of the first leadframe.
A semiconductor device 20, comprising:
- a first leadframe 200;
- a first semiconductor die 70 electrically coupled to a pin 40,80,90 of the first leadframe;
- and
- a second leadframe 300 for mounting to the first leadframe.
A package 20 for housing multiple semiconductor dice, comprising:
- a first leadframe 300 having a region 170 for mounting a first semiconductor die 130;
- and
- a second leadframe 200 having a flag 80 for mounting a second semiconductor die 70, wherein the second leadframe is mounted to a lead 45,30,35 of the first leadframe.
A semiconductor package 20, comprising a first leadframe having a first region 170 for mounting a semiconductor die 130 and a second region 160 for mounting a second leadframe 200.
A method of forming a semiconductor component 20, comprising:
- mounting a first semiconductor die 70 to a first leadframe 200;
- mounting a second semiconductor die 130 to a second leadframe 300;
- and
- mounting the first leadframe to the second leadframe.
A method of forming a semiconductor component 20, comprising:
- mounting a first semiconductor die 130 to a first leadframe 300;
- mounting a packaged semiconductor die 230 to the first leadframe;
- and
- encapsulating the first leadframe after mounting the packaged semiconductor die to the first leadframe.
A semiconductor component, comprising:
- a first leadframe 200 having a first thickness 99;
- a first semiconductor die 70 electrically coupled to the first leadframe;
- a second semiconductor die 130;
- and
- a second leadframe 300 having a second thickness 98 electrically coupled to the second semiconductor die and the first leadframe.
A semiconductor component 20, comprising:
- a first leadframe 200;
- a first semiconductor die 70 electrically coupled to a lead 40,80,90 of the first leadframe;
- a second leadframe 133;
- a second semiconductor die 134 electrically coupled to a lead 137 of the second leadframe;
- and
- a third leadframe 300 having a first lead 150,140 35 for mounting to the first leadframe and a second lead 138,139 for electrically coupling to the second leadframe.
A semiconductor package 20, comprising a first leadframe 300 having a first region 160 for mounting a second leadframe 200, and a second region 170 for mounting a third leadframe 133.
An integrated circuit, comprising:
- a first leadframe;
- a semiconductor device for mounting on the first leadframe;
- a semiconductor component;
- and
- a second leadframe having a first region for mounting the semiconductor component and a second region for mounting the first leadframe.
Dependencies are inferred from the claim text.