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AssigneeInfineon Technologies AG
InventorsHarry Hedler, Barbara Vasquez, Roland Irsigler
Estimating the term…
A contact connection between a semiconductor chip and a substrate has a conductive adhesive extending between each contact of the chip and the substrate. The conductive adhesive includes a matrix component, a filler component, a hardener component and at least one decomposable component so that after curing at a curing temperature T1, the adhesive can be decomposed either by applying thermal energy at a temperature T2>T1 or by radiation so that the two contact surfaces can be separated smoothly. After separation the purposes of replacing a defective semiconductor chip, a second chip can be mechanically connected by applying the adhesive and curing it.
A method of producing a contact connection between a semiconductor chip and a substrate, said method comprising steps of providing a substrate having a first contact surface, providing a semiconductor chip having a second contact surface, applying a curable conductive adhesive to at least one of the first contact surface and the second contact surface, the conductive adhesive having a matrix component, a filler component, a hardener component and at least one decomposable component which after curing at a temperature T1 can be decomposed by applying energy selected from radiation energy and thermal energy at a higher temperature T2>T1 so that the first contact surface and the second contact surface can be smoothly separated mechanically, joining the first contact surface and second contact surface together and curing the adhesive to strengthen the contact connection mechanically.
A contact connection between a semiconductor chip and a substrate, the connection comprising a substrate having a first contact surface, a semiconductor surface chip having a second contact surface, a curable conductive adhesive joining the first contact surface to the second contact surface, the conductive adhesive having a matrix component, a filler component, a hardener component, and at least one decomposable component which after curing at a temperature T1 can be decomposed by applying energy selected from thermal energy at a higher temperature T2>T1 and radiation so that the first contact surface and the second contact surface can be smoothly separated mechanically.
Dependencies are inferred from the claim text.