Electroconductive paste and method of forming electrode pattern
AssigneeMurata Manufacturing Co., Ltd.
InventorFumiya Adachi
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Abstract
A conductive paste which can form an electrode having a sufficient solder-wetability, exhibiting sufficient bonding strength, and having a high specific resistance is provided. The conductive paste contains a silver powdery material, glass frit and an organic vehicle. The silver powdery material contains at least about 50% by weight of a high crystalline silver powdery material with a particle size of about 4.5 μm to 7 μm and a crystal size of about 10 nm or more.
Claims20
An electroconductive paste comprising a silver powdery material, a glass frit and an organic vehicle,
- wherein the silver powdery material comprises at least 50% by weight of a high crystalline silver powdery substance with a particle size of about 4.5 μm to 7 μm and a crystal size of at least about 100 nm.
A method of forming an electrode pattern comprising the steps of:
- providing an electroconductive paste comprising a silver powdery material, a glass frit and an organic vehicle, the silver powdery material comprising at least 50% by weight of a high crystalline silver powdery substance with a particle size of about 4.5 to 7 μm and a crystal size of at least about 100 nm;
- printing the electroconductive paste onto a substrate in a predetermined pattern;
- and
- firing the electroconductive paste to form an electrode pattern having a predetermined shape and size on the substrate.
Dependencies are inferred from the claim text.