Masking flux for semiconductor components

A flux for fabricating an external contact on a semiconductor component having a contact pad and a conductive trace proximate to the contact pad comprising:

• an electrically insulating polymer resin configured for deposition onto the contact pad as a non-flowing viscous droplet configured to mask at least a portion of the conductive trace;
• a fluxing agent in the polymer resin configured to clean the contact pad;
• and
• a curing agent in the polymer resin configured to cure the polymer resin into a polymer support member attached to and rigidifying the external contact.

A flux for bonding an external contact to a contact on a semiconductor component comprising:

• a polymer resin comprising a material selected from the class consisting of epoxy, silicone and rubber configured for deposition on the contact as a viscous non-flowing droplet able to support and electrically insulate the external contact on the contact;
• a fluxing agent in the polymer resin configured to clean the contact;
• and
• a curing agent in the polymer resin configured to cure the polymer resin on the contact into a polymer support member for the external contact.

A flux for bonding a solder ball to a contact pad on a semiconductor component comprising:

• an electrically insulating polymer base material depositable on the contact pad at room temperature as a viscous non-flowing droplet configured to support the solder ball on the contact pad and to electrically insulate at least a portion of the solder ball;
• a fluxing agent in the polymer base material configured to clean the contact pad;
• and
• a curing agent in the polymer base material configured to cure the polymer base material into a support member on the component configured to support and rigidify the solder ball following bonding to the contact pad.

A flux for fabricating an external contact on a semiconductor component having a contact pad and a conductive trace proximate to the contact pad comprising:

• an electrically insulating polymer resin formulated for deposition onto the contact pad as a non-flowing viscous droplet configured to mask at least a portion of the conductive trace;
• a plurality of solder particles in the polymer resin configured to coalesce to form the external contact;
• a fluxing agent in the polymer resin configured to clean the contact pad;
• and
• a curing agent in the polymer resin configured to cure the polymer resin into a polymer support member attached to and rigidifying the external contact.

A system for bonding external contacts to contact pads on semiconductor components:

• a polymer flux;
• and
• a flux dispensing mechanism configured to deposit the flux onto the contact pads;
• the polymer flux comprising a polymer resin configured for deposition by the mechanism on the contact pads as a viscous non-flowing droplet able to support and electrically insulate the external contacts on the contact pads for bonding, a fluxing agent in the polymer resin configured to clean the contact pads;
• and a curing agent in the polymer resin configured to cure the polymer resin on the contact pads into a polymer support member for the external contact.

A system for fabricating an external contact on a semiconductor component having a contact pad comprising:

• an electrically insulating polymer flux comprising a polymer resin, a plurality of solder particles in the polymer resin configured to coalesce into a solder bump, a fluxing agent in the polymer resin configured to clean the contact pad, and a curing agent in the polymer resin configure to cure the polymer resin into a polymer support member for the solder bump, the polymer flux having a viscosity at room temperature that permits deposition as a viscous non-flowing droplet;
• a flux dispensing mechanism configured to deposit the droplet on the contact pad;
• and
• a furnace configured to heat the polymer resin and the solder particles to a temperature sufficient to bond the solder particles to the contact pad and to cure the polymer resin into the polymer support member.

A system for bonding an external contact to a contact pad on a semiconductor component:

• a solder ball;
• a polymer flux configured for deposition on the contact as a droplet of flux that supports the solder ball for bonding to the contact pad and electrically insulates at least a portion of the external contact, the polymer flux comprising a polymer resin curable on the contact pad to form a polymer support member for the solder ball, a fluxing agent in the polymer resin configured to clean the contact pad, and a curing agent in the polymer resin configured to cure the polymer resin into the polymer support member;
• a flux dispensing mechanism configured to dispense the droplet of flux on the contact pad;
• and
• a furnace configured to heat the polymer flux and the solder ball to a temperature sufficient to cure the polymer flux and to bond the solder ball to the contact pad.