Modified aperture for surface mount technology (SMT) screen printing
OwnerHeidi N. Jones, Scott A. Welleinventors
Life of this patent
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Abstract
A modified aperture shape for screen printing eliminates insufficient solder without increasing the number of solder bridges. The shape is narrow in the area where the component lead will touch and wide or overprinted in the area where the lead does not touch. To further increase solder volume the length of the aperture can also be overprinted. The overprinted areas provide greater solder volume, while the narrow area where the lead will touch prevents solder bridging.
Claims11
An aperture for depositing solder paste for mounting a component lead on a circuit card assembly, the invention comprising:
- a first width dimension comprising a first portion of a length dimension;
- and
- a second width dimension, said second width dimension being less than said first width dimension and comprising a second portion of the length dimension, wherein said second width dimension comprises a lead touching area.
An aperture for depositing solder paste for mounting a component lead on a circuit card assembly comprising:
- a first predetermined surface area;
- and
- a second predetermined surface area, wherein said second predetermined surface area is less than said first predetermined surface area and said second predetermined surface area comprises a lead touching area.
Dependencies are inferred from the claim text.