Method for drilling holes in a substrate

A method for drilling holes in a substrate, comprising:

• centering a laser beam on the substrate at a region of a hole to be drilled, and
• moving the laser beam within the cross-sectional area of the hole with a beam spot diameter that is smaller than a hole diameter in concentric circular tracks with a radius changing in steps,
• wherein a transition from one circular track to a respective next circular track (K1 to K5) having a different radius takes place in each case in the form of an arc (b1 to b6) departing approximately tangentially from a circular track last traversed, the circular track last traversed nestled approximately tangentially against a next circular track in such a way that in each case a starting point (A to E;
• A1 to E2) of the next circular track (K2 to K6) is offset by a prescribed angle from starting and end points of a preceding circular track (K1 to K5).