Method for producing a trench structure in a polymer substrate
AssigneeSiemens Aktiengesellschaft
InventorsHubert De Steur, Stefan Lesjak, Wei Pan
Life of this patent
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Abstract
In order to produce a trench structure having steep sidewalls free of residues in an, in particular, glass-fiber-reinforced substrate, the substrate is provided with a conformal mask having cutouts corresponding to the trench structure to be produced. In this case, the laser beam is guided over the cutouts of the mask in such a way that the low-energy edge regions of the laser beam are shielded and that proportion of the laser beam which impinges on the polymer surface, at each point, has an energy density above a threshold at which the substrate material including a glass fiber reinforcement that is possibly present is completely removed.
Claims26
A method for producing a trench structure in the surface of a polymer substrate by irradiation with a laser, comprising the following steps:
- arranging a conformal mask, made of a material which reflects the laser radiation, on the surface of the substrate, wherein the mask includes cutouts corresponding to the trench structure to be produced;
- and
- guiding the laser beam over the cutouts of the mask, said laser beam being guided at least once over the boundary edge of the respective cutouts in an overlapping manner such that an energy density of that proportion of the laser beam which impinges on the polymer surface, at each point, lies above a threshold at which the substrate material is completely removed.
A method for producing a trench structure in the surface of a polymer substrate by irradiation with a laser, comprising:
- guiding a beam of the laser over cutouts of a mask made of a material which reflects laser radiation, the mask being arranged on the surface of the substrate, wherein the laser beam is guided over a boundary edge of each respective cutout such that an energy density, of a proportion of the laser beam which impinges on the polymer surface, lies above a threshold at which the substrate material is completely removed.
Dependencies are inferred from the claim text.