Minimizing whisker growth in tin electrodeposits
AssigneeTechnic, Inc.
InventorsRobert A. Schetty III, Winnie Ruth Vickers
Life of this patent
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Abstract
The present invention relates to a method for reducing tin whisker formation in tin deposits by plating on an underlying metal tin deposits which are predominantly in a predetermined crystal orientation that essentially matches that of the underlying metal in order to inhibit tin whisker growth. The most preferred crystal orientation is one that is the same as that of the underlying metal. The deposit preferably contains at least 95% tin and optionally at least one alloying element of silver, bismuth, copper or zinc in an amount of 5% or less. Advantageously, the tin deposits are provided during electroplating from a specially formulated plating solution.
Claims25
A method for reducing tin whisker formation in tin deposits, which comprises plating tin deposits on a metal which deposits are predominantly in a predetermined crystal orientation that essentially matches that of the underlying metal in order to inhibit tin whisker growth.
A plating solution comprising an acid, a tin salt, and a crystal orienting surfactant in an amount sufficient to assist in providing tin deposits on an underlying metal, which deposits are predominantly in a predetermined crystal orientation that essentially matches that of the underlying metal in order to inhibit tin whisker growth.
Dependencies are inferred from the claim text.