Apparatus and method for electropolishing a substrate in an electroplating cell
AssigneeApplied Materials, Inc.
InventorsSrinivas Gandikota, Muhammad Atif Malik, Michael Wood
Life of this patent
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Abstract
An electrolyte cell receives a substrate for processing, a first electrode disposed in the electrolyte cell, the first electrode comprising at least a contact ring, a second electrode disposed within the electrolyte cell and spaced from the first electrode, and a porous membrane that is connected to the electrolyte cell and extends across at least a portion of the electrolyte cell, the membrane is positioned between a location for positioning a substrate when processing and surrounding electrolyte.
Claims34
An apparatus for electrochemically processing a substrate, comprising:
- an electrolyte cell configured to receive a substrate for processing;
- a substrate support in the electrolyte cell, the substrate support comprising at least a substrate seating surface;
- a fixed electrode disposed within the electrolyte cell and spaced from the substrate support;
- and
- a porous membrane that is connected to the electrolyte cell and extends across at least a portion of the electrolyte cell, wherein the membrane is positioned between the substrate seating surface and a substrate.
An apparatus for electrochemically processing a substrate, comprising:
- an electrolyte cell configured to receive a substrate to have a conductive material film deposited thereon or removed therefrom;
- a substrate support;
- a contact ring in electrical communication with the substrate support, wherein the contact ring comprises at least a portion of a first electrode;
- a second electrode disposed on a bottom portion of a electrolyte cell;
- a power source coupled to the contact ring and second electrode;
- a source of electrolyte in fluid communication with the electrolyte cell;
- and
- a porous membrane connected to the electrolyte cell and extends across at least a portion of the electrolyte cell, wherein the porous membrane is positioned between the first electrode and the second electrode.
An apparatus for use in an electrolyte cell, the apparatus comprising:
- a porous membrane that is connected to and extends across a portion of the electrolyte cell, wherein the porous membrane is positioned between a first electrode and a second electrode disposed in the electrolyte cell, and wherein the porous membrane is formed a ceramic material, a polymer, a polishing material, or combinations thereof, having pore sizes between about 0.25 μm and about 2 μm wide.
A method for processing a substrate, comprising:
- positioning a substrate in the electrolyte cell adjacent a porous membrane;
- supplying an electrolyte solution to the electrolyte cell and through the porous membrane to a substrate surface;
- and
- delivering power to the substrate and an electrode disposed in the electrolyte cell to perform an electrochemical process.
A contact ring for use in an apparatus for electroplating a metal onto a substrate having an electrically conductive portion, the contact ring comprising:
- an annular insulative body defining a central opening;
- a plurality of conductive elements disposed through the insulative member;
- and
- a porous membrane assembly disposed on the annular insulative body, wherein the porous membrane assembly comprises a porous material disposed within the central opening.
Dependencies are inferred from the claim text.