Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system
AssigneeLam Research Corporation
InventorsJohn M. Boyd, Aleksander Owczarz, Miguel Saldana
Life of this patent
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Abstract
A method and apparatus is disclosed for polishing a semiconductor wafer. A polishing pad including a first surface and a semiconductor wafer including a second surface are aligned to each other. To allow alignment of an axis of rotation of the surfaces, at least one of the first and second surfaces includes an adjustable axis of rotation. After the axis of rotation of the first and second surfaces is aligned, the adjustable axis of rotation is set, preferably with a magneto-rheological fluid or similarly acting material, to maintain a fixed position. Thereafter, the polishing pad is utilized to polish the semiconductor wafer.
Claims45
A method for aligning a first rotating surface and a second rotating surface, the method comprising:
- providing a first rotating surface;
- providing a second rotating surface, wherein at least one of an axis of rotation of the first and second rotating surfaces is adjustable;
- and
- setting the axis of rotation of the adjustable axis with a material that operates to allow adjustment of an angle of the axis of rotation and then maintain the angle after the axis of rotation of the first and second surfaces are aligned to each other.
A method for polishing a semiconductor wafer, the method comprising:
- providing a polishing pad including a first surface;
- providing a semiconductor wafer including a second surface;
- aligning an axis of rotation of the first surface and the second surface to each other, wherein at least one of the first and second surfaces includes an adjustable axis of rotation;
- setting the axis of rotation of the adjustable surface to maintain a position of the adjustable axis after the first and second surfaces are aligned;
- and
- polishing the semiconductor wafer with the polishing pad.
An apparatus for polishing a semiconductor wafer, comprising:
- a polishing pad including a first surface;
- a semiconductor wafer including a second surface opposing the first surface of the polishing pad, wherein at least one of an axis of rotation of the first surface and the second surface is adjustable;
- and
- a fluid around the axis of rotation of the adjustable surface operable to maintain a position of the axis of rotation after the axis of rotation of the first and second surfaces are aligned, wherein the semiconductor wafer is polished with the polishing pad after the axis of rotation are aligned.
A method for etching a semiconductor wafer, the method comprising:
- providing a first electrode surface;
- providing a second electrode surface;
- providing a semiconductor wafer on one of the first and second electrode surfaces;
- aligning an axis of first electrode surface and the second electrode surface to each other, wherein at least one of the first and second electrode surfaces includes an adjustable axis perpendicular to the surface of the adjustable axis;
- setting axial alignment of the adjustable surface to maintain a position of the adjustable axis after the first and second electrode surfaces are aligned;
- and
- etching the semiconductor wafer.
A method for depositing a uniform film on a semiconductor wafer, the method comprising:
- providing a first electrode surface;
- providing a second electrode surface;
- providing a semiconductor wafer on one of the first and second electrode surfaces;
- aligning an axis of the first electrode surface and the second surface to each other, wherein at least one of the first and second electrode surfaces includes an adjustable axis of perpendicular to the surface of the adjustable axis;
- setting the axial alignment of the adjustable surface to maintain a position of the adjustable axis after the first and second electrode surfaces are aligned;
- and
- depositing a film on the semiconductor wafer.
Dependencies are inferred from the claim text.