Method and apparatus for demounting workpieces from adhesive film
AssigneeApplied Optoelectronics, Inc.
InventorsBrian Ishaug, Chung-Yung Wang, Hung-Lun Chang
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AssigneeApplied Optoelectronics, Inc.
InventorsBrian Ishaug, Chung-Yung Wang, Hung-Lun Chang
Estimating the term…
Demounting workpieces attached to an adhesive surface of an adhesive film with a workpiece demounting apparatus having a base and a plurality of substantially parallel blades mounted to the base. Each of the blades has a substantially linear blade edge, each blade edge lying within a blade-edge plane that is substantially perpendicular to the blades. The spacing between the blades is small enough to support said workpieces and large enough to permit the adhesive film to pass between the blades after being cut by said blade edges during a workpiece demounting operation. The plurality of blade edges thus provides a substantially planar blade-edge surface, in the blade-edge plane, for cutting the adhesive film and for supporting the workpieces while the adhesive film is pulled free from said workpieces.
An apparatus for demounting workpieces attached to an adhesive surface of an adhesive film, the apparatus comprising:
A method for demounting workpieces attached to an adhesive surface of an adhesive film, the adhesive film having a bottom surface, the method comprising the steps of:
Dependencies are inferred from the claim text.