Ultrasonic cleaning module
AssigneeASM Assembly Automation Ltd.
InventorsYiu Ming Cheung, Chak Tong Albert Sze
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Abstract
The invention provides an ultrasonic cleaning module and a method for cleaning singulated electronic packages. The module comprises a cutting chuck having a surface with a plurality of cutting recesses defined in it for enabling a cutting device to separate individual electronic packages from a substrate having a plurality of electronic packages on the surface of the chuck. A pulsator nozzle is supported above the chuck and the separated electronic packages on the chuck such that the pulsator nozzle may emit fluid toward the packages. An ultrasonic generator is associated with the nozzle that is adapted to ultrasonically energize fluid that passes through the nozzle to enhance cleaning of the packages.
Claims25
An ultrasonic cleaning module comprising:
- a cutting chuck having a surface with a plurality of cutting recesses defined in it for enabling a cutting device to separate individual electronic packages from a substrate having a plurality of electronic packages on the surface of the chuck;
- a pulsator nozzle supported above the chuck and the separated electronic packages on the chuck such that the pulsator nozzle may emit fluid toward the packages;
- and
- an ultrasonic generator associated with the nozzle that is adapted to ultrasonically energize fluid that passes through the nozzle.
A method of forming electronic packages from a common substrate having a plurality of electronic packages and cleaning the electronic packages, comprising:
- placing a substrate of electronic packages on a surface of a chuck;
- holding the substrate to the chuck surface;
- separating the substrate into individual electronic packages while holding the substrate and packages to the chuck;
- thereafter directing a stream of fluid onto the separated electronic packages through a pulsator nozzle and activating an ultrasonic generator to apply ultrasonic energy to the fluid that passes through the nozzle.
Dependencies are inferred from the claim text.