Flux for solder paste
AssigneeShowa Denko K.K.
InventorsHitoshi Amita, Takashi Shoji, Shunsuke Nagasaki, Yoshinori Shibuya, Isamu Taguchi, Noriko Murase
Life of this patent
Estimating the term…
Abstract
A solder powder comprises solder particles having a distribution such that the number of particles having a particle diameter of 20 μm or less is 30% or less, wherein the oxygen content is 500 ppm or less. A flux for solder paste comprises an organic acid component consisting of an organic acid ester and an ester decomposer catalyst, an organic halogen compound, a reducing agent and a resin component. A solder paste mainly comprises a flux and a solder powder, wherein the water content of the solder paste is 0.5% by weight or less.
Claims34
A solder powder comprising solder particles having a distribution such that the number of particles having a particle diameter of 20 μm or less is 30% or less.
A flux for solder paste comprising an organic acid component consisting of an organic acid ester and an ester decomposer catalyst, an organic halogen compound, a reducing agent, and a resin component.
A solder paste mainly comprising a flux and a solder powder.
A method for joining metals comprising the steps of:
- applying a solder paste which contains Sn and Zn to each joining portion of one or more metals selected from the group of aluminum, aluminum alloy, copper, and copper alloy;
- and reflowing the applied solder paste.
Dependencies are inferred from the claim text.