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US 2003/0200702 A1Published application
Bimodal slurry system
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShen-Nan Lee, Tsu Shih, Syun Ming Jang
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Abstract
A bimodal slurry system for a chemical mechanical polishing process including a dispersion comprising a plurality of first particles and a plurality of at least one type of second particles said first particles having a mean particle diameter larger by at least a factor of 3 than a mean particle diameter of the at least one type of second particles said first particles further being compressible.
Claims20
A bimodal slurry system for a chemical mechanical polishing process comprising:
- a dispersion comprising a plurality of first particles and a plurality of at least one type of second particles said first particles having a mean particle diameter larger by at least a factor of 3 than a mean particle diameter of the at least one type of second particles said first particles further being compressible.
Dependencies are inferred from the claim text.