Method for assembling tiled detectors for ionizing radiation based image detection

A method for assembling an imaging structure, comprising the acts of:

• soldering a first element of the imaging structure using a first material;
• and
• subsequently soldering a second element of the imaging structure using a second material having a lower melting point than the first material.

The method of claim the 32, wherein at least one of the acts of soldering the first element and subsequently soldering the second element comprises the act of electrically connecting adjacent layers of the multiple layers through vias.

The method of claim of 34, wherein the act of connecting comprises the act of reflowing a plurality of solder bumps formed by the first material.

The method of claim of 34, wherein the act of subsequently soldering the second element comprises the act of electrically connecting the semiconductor wafer to a circuit board.

The method of claim and 58, wherein the acts of attaching the plurality of detector/die tiles and tiling the plurality of multi-detector modules comprises the act of forming intermediate connections between each of the plurality of detector/die tiles and the circuit board and between each circuit board and the primary circuit board.

The method of claim the 70, wherein the act of tiling the plurality of multi-detector modules comprises the act of creating a plurality of intermediate solder bump connections between the primary circuit board and each of the plurality of multi-detector modules.

A method for assembling detector tiles for an imaging system, comprising the acts of:

• overlapping edge portions of a plurality of detector modules at edge-based electrical connections at each adjacent module of the plurality of detector modules;
• and
• removing overlapping image data from one detector module of each overlapping pair of the detector modules.