Semiconductor device analysis system
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorToshikazu Tsutsui
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Abstract
A semiconductor device analysis system is provided. In a data analysis mechanism (2a) included in a data analyzing EWS, a failure generator (11) artificially generates failure shape data about the shape of a failure assumed to occur in an actual semiconductor device. An analysis database (9) stores therein failure shape recognized data provided from a failure shape recognizer (8) and the failure shape data provided from the failure generator (11). A data processor (10) performs a failure analysis process based on the failure shape recognized data and the failure shape data.
Claims13
A semiconductor device analysis system having a data analysis mechanism for analyzing a failure location and a failure shape in a semiconductor device, said data analysis mechanism comprising:
- a failure shape data generator for artificially generating failure shape data specifying the shape of a failure in a device;
- and
- a failure analysis processor for performing a failure analysis process based on said failure shape data.
Dependencies are inferred from the claim text.