Polyamide resin
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsKazunobu Maruo, Tomomichi Kanda, Koji Yamamoto
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AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsKazunobu Maruo, Tomomichi Kanda, Koji Yamamoto
Estimating the term…
The polyamide resin of the present invention is produced by polycondensation of a diamine component comprising 70 mol % or more of m-xylylenediamine and a dicarboxylic acid component comprising 70 mol % or more of a C4-C20 α, ω-straight-chain aliphatic dicarboxylic acid in the presence of at least one phosphorus compound selected from the group consisting of phosphinic acid compounds and phosphonous acid compounds and in the presence of an alkali metal compound of a weak acid. The weak acid has a dissociation constant lower than a first dissociation constant of a dicarboxylic acid mainly constituting the polyamide resin. The polyamide resin satisfies the following requirements (A), (B) and (C): 14000≦a≦40000 (A) b≦1.000 (B) 0.9930≦b−1.1a2×10−11+3.2a×10−7≦0.9980 (C) wherein a and b are as defined in the disclosure.
A polyamide resin produced by polycondensation of a diamine component comprising 70 mol % or more of m-xylylenediamine and a dicarboxylic acid component comprising 70 mol % or more of a C4-C20 α, ω-straight-chain aliphatic dicarboxylic acid, wherein the polycondensation is performed in the presence of at least one phosphorus compound selected from the group consisting of phosphinic acid compounds and phosphonous acid compounds in an amount of 3 to 400 ppm in terms of phosphorus atom based on a theoretical yield amount of the polyamide resin and in the presence of an alkali metal compound of a weak acid having a dissociation constant lower than a first dissociation constant of a dicarboxylic acid mainly constituting the polyamide resin in an amount of 0.5 to 1.0 mol per one mole of the phosphorus compound, and wherein the polyamide resin satisfies the following requirements (A), (B) and (C):
Dependencies are inferred from the claim text.