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US 2003/0199625 A1Published application
Low-density thermosetting sheet molding compounds
OwnerHelena Twardowska, Laurence G. Dammann +1inventors
InventorsHelena Twardowska, Laurence G. Dammann, Dennis H. Fisher
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Abstract
This invention relates to low-density thermosetting sheet molding compounds (SMC) comprising a treated inorganic clay, a curative, a low profile agent, a reinforcing agent, and preferably a low-density filler. The thermosetting SMC are used to prepare exterior and structural thermoset articles, e.g. auto parts, panels, etc.
Claims38
A thermosetting sheet molding composition comprising:
- (a) a treated inorganic clay,
- (b) a thermosetting monomer and/or resin,
- (c) a low profile additive;
- and
- (d) a reinforcing agent.
2 more elements
A process for preparing a thermoset molded article comprising:
- (a) introducing a thermosetting sheet molding composition comprising:
- (1) a treated inorganic clay,
- (2) a thermosetting monomer and/or resin,
- (3) a low profile additive;
- and
- (4) a reinforcing agent
- into a pattern to form a shape;
- (b) curing the shape prepared by (a).
5 more elements
Dependencies are inferred from the claim text.