Radiation curable adhesive compositions comprising block copolymers having vinyl functionalized polydiene blocks

A radiation curable adhesive composition comprising:

• a) from about 10 wt % to about 40 wt % of at least one block copolymer having at least two blocks wherein the first block is a polyvinyl aromatic block and the second block is a polydiene block having vinyl functionality;
• b) from about 10 wt-% to about 80 wt-% of least one tackifier that is compatible with the polydiene block;
• and
• c) from about 10 wt % to about 40 wt % of at least one plasticizer selected from the group consisting of polyvinyl aromatic block compatible plasticizers having softening point of no greater than 100° C., polydiene compatible plasticizers having a weight average molecular weight of no less than 20,000, and the combinations thereof.

A radiation curable adhesive composition comprising:

• a) from about 10 wt % to about 40 wt % of at least one block copolymer having at least two blocks wherein the first block is a polyvinyl aromatic block and the second block is a polydiene block having vinyl functionality;
• b) from about 5 wt % to about 40 wt % of at least one second polymer selected from the group consisting of styrenic block copolymers, ethylene/α-olefin interpolymers, interpolymers of ethylene, and mixtures thereof;
• and
• c) from about 10 wt % to about 90 wt % of at least one tackifier.

A radiation curable adhesive composition comprising:

• a) from about 10 wt-% to about 50 wt-% of at least one block copolymer having at least two blocks wherein the first block is a polyvinyl aromatic block and the second block is a polydiene block having vinyl functionality;
• b) from about 20 wt % to about 55 wt-% of at least one tackifier;
• c) from about 10 wt % to about 40 wt-% of at least one wax;
• and
• d) from about 0 wt % to about 35 wt % of at least one plasticizer.