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AssigneeApplied Materials, Inc.
InventorsLidia Vereen, Peter N. Skarpelos, Brian J. Downum, Patrick Williams, Terry Kin-Ting Ko, Christopher Heung-Gyun Lee, Kenneth Reese Reynolds, John Hearne, Daniel Hachnochi
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A method and apparatus for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one embodiment, an apparatus for delivering a polishing fluid to a chemical mechanical polishing surface includes an arm having a plurality of holes formed in the arm for retaining a plurality of polishing fluid delivery tubes. Each of the tubes are disposed through one of the holes and coupled to the arm. The number of holes exceeds the number of tubes, thereby allowing the distribution of polishing fluid to a polishing surface and correspondingly the local polishing rates across a diameter of a substrate being polished to be controlled.
Apparatus for delivering a polishing fluid to a polishing surface of a chemical mechanical polisher, the apparatus comprising:
Apparatus for delivering a polishing fluid to a polishing surface of a chemical mechanical polisher, the apparatus comprising:
A method for delivering a polishing fluid to a polishing surface of a chemical mechanical polisher, the method comprising:
A method for delivering a polishing fluid to a polishing surface of a chemical mechanical polisher, the method comprising:
A method for delivering a polishing fluid to a polishing surface of a chemical mechanical polisher, the method comprising:
Apparatus for delivering a polishing fluid to a polishing surface of a chemical mechanical polisher, wherein an outlet of the tube adapted to dispense polishing fluid to the pad extends below the underside of the arm.
Dependencies are inferred from the claim text.