Electronic component having high mechanical strength and method of manufacturing a metal cover included in the electronic component
AssigneeJapan Aviation Electronics Industry, Limited
InventorsDaisuke Machihara, Joe Motojima, Masaaki Shimada
Life of this patent
Estimating the term…
Abstract
In an electronic component having a frame (11) and a cover (12) coupled to the frame, the cover has a flat plate portion (21) and a reinforcing portion (22) that is bent from one edge of the flat plate portion toward one surface side thereof and extends along such one edge. A plurality of press-fit portions (24) protrude from the flat plate portion towards the one surface side thereof in the neighborhood of the reinforcing portion. The press-fit portions are press-fitted into the frame. The press-fit portions can be formed by applying blanking and bending processes to a portion of the flat plate portion.
Claims12
An electronic component having a frame and a cover coupled to said frame, said cover comprising:
- a flat plate portion;
- a reinforcing portion that is bent from one edge of said flat plate portion toward one surface side thereof and extends along said one edge;
- and
- a plurality of press-fit portions each protruding from said flat plate portion toward said one surface side thereof in the neighborhood of said reinforcing portion and press-fitted into said frame, said press-fit portions being formed by applying blanking and bending processes to a portion of said flat plate portion.
Dependencies are inferred from the claim text.