Load port, semiconductor manufacturing apparatus, semiconductor manufacturing method, and method of detecting wafer adapter

A semiconductor manufacturing apparatus for use with a front-opening type pod accommodating first semiconductor wafers having a first predetermined size, wherein the pod includes a lid and when a wafer adapter is mounted in the pod, the pod is capable of containing second semiconductor wafers having a second predetermined size different from the first predetermined size, the semiconductor manufacturing apparatus comprising:

• a load port on which the pod is placed;
• an opener arranged at the load port for opening the lid;
• an optical adapter-detecting sensor arranged at the load port, wherein the optical adapter-detecting sensor detects whether the wafer adapter is mounted in the pod when the opener opens the lid of the pod, and generates a detection signal;
• and
• a processing chamber for carrying out at least one processing operation on the semiconductor wafers depending on the size of the semiconductor wafers in accordance with the detection signal.

A method for manufacturing semiconductor devices comprising:

• accommodating first semiconductor wafers having a first predetermined size in a front-opening type pod or mounting a wafer adapter in the pod and accommodating second semiconductor wafers having a second predetermined size different from the first predetermined size in the pod;
• setting the pod on a load port;
• opening a lid of the pod;
• optically detecting whether the wafer adapter is mounted in the pod;
• determining the size of the semiconductor wafers contained in the pod based on a result of the detection;
• carrying the semiconductor wafers from the pod to a processing chamber;
• and
• executing at least one processing operation depending on the size of the semiconductor wafers in the processing chamber.

A method for detecting whether a front-opening type pod for containing first semiconductor wafers of a first predetermined size has a wafer adapter mounted therein for accommodating second semiconductor wafers of a second predetermined size different from the first predetermined size, wherein the pod includes a lid, the method comprising:

• setting the pod on the load port;
• bringing an opener into engagement with the lid of the pod and moving the opener downward together with the lid to open the lid;
• and
• optically detecting whether the wafer adapter is mounted in the pod by a sensor arranged at an upper portion of the opener, while opening the lid.

A load port for use with a front-opening type pod capable of containing first semiconductor wafers of a first predetermined size, wherein the pod includes a lid and when a wafer adapter is mounted in the pod, the pod is capable of containing second semiconductor wafers of a second predetermined size different from the first predetermined size, the load port comprising:

• a carrier stage for supporting the pod;
• an opener for opening the lid of the pod by engaging with the lid and moving downward together with the lid;
• and
• an adapter-detecting sensor arranged at an upper portion of the opener for detecting whether the wafer adapter is mounted in the pod, the adapter-detecting sensor including a light-irradiating device for irradiating light toward the wafer adapter, and a light-receiving device for receiving light reflected by the wafer adapter when light is irradiated towards the wafer adapter by the light-irradiating device.