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US 2003/0199160 A1Published application
Use of palladium in IC manufacturing with conductive polymer bump
AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, Salman Akram
Life of this patent
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Abstract
An apparatus and a method for forming a substrate having a palladium metal layer over at least one contact point of the substrate and having a flexible conductive polymer bump, preferably a two-stage epoxy, on the palladium plated contact point. The present invention also relates to assemblies comprising one or more of these substrates.
Claims22
A method of forming a conductive bump on a substrate having a conductive electrode, comprising:
- applying at least one layer of palladium on a portion of said conductive electrode of said substrate;
- and
- disposing a two-stage, conductive polymer bump on a portion of said at least one palladium layer.
A method for forming a semiconductor assembly having a plurality of substrates, each substrate having at least one conductive electrode, comprising:
- applying a layer of palladium on a portion of said at least one conductive electrode of one substrate of said plurality of substrates;
- and
- disposing a two-stage conductive polymer bump between a portion of at least one of said at least one conductive electrode having said palladium layer thereon of said substrate of said plurality of substrates and a portion of said at least one conductive electrode of another substrate of said plurality of substrates for forming an electrical contact therebetween.
Dependencies are inferred from the claim text.