Wafer alignment mark for image processing, image processing alignment method and method of manufacturing semiconductor device
AssigneeNEC Electronics Corporation
InventorMasashi Fujimoto
Life of this patent
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Abstract
An alignment mark is arranged to be within an image screen and the alignment mark is formed with rectangular patterns having varied dimensions from each other. The signal waveforms from each of the rectangular patterns are measured. The number of the rectangular patterns with normal waveforms is compared to the minimum required number of marks prescribed beforehand. The amount of deviation in alignment is calculated by excluding the abnormal measured result.
Claims19
A wafer alignment mark for image processing, comprising:
- a wafer alignment mark;
- and
- a plurality of rectangular patterns provided in the wafer alignment mark, wherein
- the wafer alignment mark is disposed near a peripheral edge within a range of a shot to be picked up, and
- the rectangular patterns are plurality of the rectangular patterns formed smaller than the wafer alignment mark while being in different dimensions from each other.
An image processing alignment method, comprising the steps of:
- a first step of picking up, in a shot, a wafer alignment mark with a plurality of rectangular patterns having different dimensions from each other;
- and
- a second step of scanning a plurality of the rectangular patterns in the picked up wafer alignment mark.
A method of manufacturing a semiconductor device for executing, in a photolithography step, an image processing alignment method which comprises at least a first step of picking up, in a shot, a wafer alignment mark with a plurality of rectangular patterns having different dimensions from each other and a second step of scanning a plurality of the rectangular patterns in the picked up wafer alignment mark.
Dependencies are inferred from the claim text.