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US 2003/0199120 A1Published application
Semiconductor device and fabrication process therefor
AssigneeRohm Co., Ltd.
InventorsKazutaka Shibata, Junji Oka, Yasumasa Kasuya
Life of this patent
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Abstract
A semiconductor device which includes: a semiconductor chip bonded to a surface of a solid device; and a stiffener surrounding the periphery of the semiconductor chip. A surface of the stiffener opposite from the solid device is generally flush with a surface of the semiconductor chip opposite from the solid device.
Claims14
A semiconductor device comprising:
- a semiconductor chip bonded to a surface of a solid device;
- and
- a stiffener surrounding the periphery of the semiconductor chip with a surface thereof opposite from the solid device being generally flush with a surface of the semiconductor chip opposite from the solid device.
A fabrication process for a semiconductor device, comprising the steps of:
- bonding a semiconductor chip to a surface of a solid device with an active surface of the semiconductor chip being opposed to the solid device;
- providing a synthetic resin material to surround the periphery of the semiconductor chip with the synthetic resin material for formation of a stiffener;
- and
- simultaneously planarizing the semiconductor chip bonded to the surface of the solid device and the synthetic resin material provided around the semiconductor chip after the resin providing step, so that a surface of the semiconductor chip opposite from the active surface is generally flush with a surface of the synthetic resin material opposite from the solid device.
1 more element
Dependencies are inferred from the claim text.