Electro-optical device, method for fabricating the same, and electronic apparatus
AssigneeSeiko Epson Corporation
InventorTakefumi Fukagawa
Life of this patent
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Abstract
The invention provides a liquid crystal device having a structure in which electrical conduction between substrates is maintained and the cell gap can be easily controlled. A liquid crystal device of the present invention can include a TFT array substrate and a counter substrate facing each other, and a liquid crystal is interposed between the substrates. A conductive layer is applied to a protrusion provided on the counter substrate to form an intersubstrate conductive part. By placing the intersubstrate conductive part inside a sealant, stable electrical conduction between the TFT array substrate and the counter substrate can be performed, and a predetermined cell gap is maintained.
Claims21
An electro-optical device, comprising:
- a pair of substrates facing each other;
- an electro-optical material disposed therebetween;
- a conductive section that is provided on the inner surface of each of the pair of substrates;
- and
- an intersubstrate conductive part including a protrusion coated with a conductive layer that is provided on one of the pair of substrates, the conductive sections of the individual substrates being electrically connected to each other through the intersubstrate conductive part.
An electro-optical device, comprising:
- a pair of substrates facing each other;
- an electro-optical material interposed therebetween;
- a conductive section that is provided on the inner surface of each of the pair of substrates;
- and
- a protrusion that is provided on one of the pairs of substrates, the protrusion maintaining a predetermined distance between the pair of substrates, the conductive sections of the individual substrates being electrically connected to each other through an intersubstrate conductive part including the protrusion coated with a conductive layer.
A method for fabricating an electro-optical device having an electro-optical material interposed between a pair of substrates facing each other, the method comprising:
- forming a protrusion on one of the substrates, and
- forming a conductive layer on the protrusion to produce an intersubstrate conductive part.
Dependencies are inferred from the claim text.