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AssigneeHitachi, Ltd.
InventorsYuichi Hamamura, Takaaki Kumazawa, Hisao Asakura, Kazuyuki Tsunokuni, Aritoshi Sugimoto
Estimating the term…
A manufacturing method of an electronic device is to improve test efficiency using test structure and improve yield. The manufacturing method performs test using a first lead wire disposed on an insulating layer formed on a substrate and a second lead wire electrically connected to the substrate and disposed on the insulating layer and manages the electronic device on the basis of results of the test to manufacture the electronic device. The manufacturing method includes a step of testing whether the first lead wire is disconnected or not by measuring an electric resistance between both ends of the first lead wire and a step of testing whether the first and second lead wires are short-circuited or not by measuring an electric resistance between the first lead wire and the substrate.
A method of manufacturing an electronic device, comprising:
A method of manufacturing an electronic device, comprising:
A wafer including an electronic device and lead wires for test of said electronic device, said electronic device and said lead wires being formed on a substrate, wherein said lead wires comprises a first lead wire for detection of open circuit and second lead wires for detection of short circuit formed on said substrate through an insulating layer, and said second lead wires are electrically connected to said substrate.
A wafer including an electronic device and lead wires for test of said electronic device, said electronic device and said lead wires being formed on a substrate, wherein said lead wires comprises a first lead wire for detection of open circuit and second lead wires for detection of short circuit formed on said substrate through an insulating layer, and said second lead wires are connected to said substrate by means of channels through contact plugs.
Dependencies are inferred from the claim text.