Processing substrate and/or support surface and method of producing same
OwnerWilliam E. LeBoeuf, Virginia D. Karulinventors
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Abstract
A processing substrate includes an absorbent material layer and randomly spaced strands of thermoplastic material disposed on a side of the absorbent material layer forming a cut resistant and liquid pervious surface. The method of producing the processing substrate includes providing an absorbent material layer, moving the absorbent material layer, and depositing randomly spaced strands of material onto a side of the absorbent material layer to form a cut resistant and liquid pervious surface.
Claims30
A processing substrate, comprising:
- an absorbent material layer;
- and
- randomly spaced strands of material disposed on a side of the absorbent material layer forming a cut resistant and liquid pervious surface.
A processing substrate, comprising:
- an absorbent material layer;
- a liquid pervious layer attached to a first side of the absorbent material layer, wherein the liquid pervious layer includes randomly spaced strands of material;
- and
- a liquid impervious barrier layer attached to a second side of the absorbent material layer.
A method of producing a processing substrate, the method comprising the steps of:
- providing an absorbent material layer;
- moving the absorbent material layer;
- and
- depositing randomly spaced strands of material onto a side of the absorbent material layer to form a cut resistant and liquid pervious surface.
Dependencies are inferred from the claim text.