System and method for curing printed circuit board coatings

Abstract

A method for curing a layer of liquid coating applied to surfaces of a printed circuit board is disclosed. The method comprises exposing the layer of liquid coating to a curing agent; and manipulating the printed circuit board during the exposure so as to prevent the liquid coating from flowing from its applied location in response to gravitational forces. An apparatus for implementing the above method is also disclosed. The apparatus comprises a motorized assembly for rotating the printed circuit board. The apparatus also comprises a controller that controls the motorized assembly to rotate the printed circuit board about one or more horizontal axes extending through a plane that includes the printed circuit board while a liquid coating applied to surfaces thereof is being cured.

Dependencies are inferred from the claim text.