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US 2003/0198445 A1Published application
Optical link module
AssigneeSumitomo Electric Industries, Ltd.
InventorsTakayoshi Inujima, Kazushige Oki, Hiromi Kurashima, Eiji Tsumura
Life of this patent
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Abstract
An optical link module comprises a transmitting optical sub-assembly (TOSA), a receiving optical subassembly (ROSA), a board and electronic parts. The electronic parts are necessary for wire-bonding to connect electronic thereto and mounted only on either the first surface or the second surface of the board.
Claims14
An optical link module installed on a mother board, the module having a transmitting circuit and a receiving circuit, comprising:
- transmitting optical sub-assembly electronic connected to the transmitting circuit;
- a receiving optical sub-assembly electronic connected to the receiving circuit;
- a board having a first surface and a second surface opposite to the first surface;
- and
- a plurality of electronic parts electronic connected to the board by wire bonding to the board,
- wherein the electronic parts are mounted only on either the first surface and the second surface.
3 more elements
Dependencies are inferred from the claim text.