Lens cap for semiconductor laser package
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorNan Tsung Huang
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Abstract
A lens cap (40) in accordance with a preferred embodiment of the present invention for a semiconductor laser package (not shown) includes an optical element (31) made of a plastic material and a housing (20). The housing includes a top portion (21), a cylindrical sidewall (25) and an annular flange 22. An opening (23) is defined in the top portion. A ridge (24) is formed along an edge of the opening and protrudes into the opening. The optical element is insert molded into the housing, providing a strong structure which is not easily damaged, while still allowing transmittal of light through the opening. Since the optical element is made of a plastic material, the lens cap is comparatively inexpensive.
Claims12
A lens cap for a semiconductor laser package comprising:
- an optical element made of a plastic material for permitting passage of laser emission therethrough;
- and
- a housing, including a top portion, an opening being provided in the top portion;
- wherein the optical element is insert molded into the opening.
A lens cap for a semiconductor laser package comprising:
- an optical element made of a plastic material;
- and
- a housing, including a top portion, a sidewall depending from outer edges of the top portion and a flange for securely engaging with a base of the semiconductor laser package, a window being provided in the top portion;
- wherein the optical element is integrally formed with the window by way of insert-molding.
A semiconductor laser package comprising:
- a cap enclosing a pair of diodes;
- said cap defining an opening filled with a plastic optical element;
- and
- means for retaining the plastic optical element in the opening;
- said plastic optical element and the pair of diodes being arranged to have light from one of said pair of diodes hit the plastic optical element and reflected toward the other one of the pair of diodes.
Dependencies are inferred from the claim text.