Sensing method and apparatus for resistance memory device
AssigneeMicron Technology, Inc.
InventorR. J. Baker
Life of this patent
Estimating the term…
Loading patent…
AssigneeMicron Technology, Inc.
InventorR. J. Baker
Estimating the term…
An MRAM memory integrated circuit is disclosed. Resistance, and hence logic state, is determined by discharging a first charged capacitor through an unknown cell resistive element to be sensed at a fixed voltage, and a pair of reference capacitors. The rate at which the parallel combination of capacitors discharge is between the discharge rate associated with a binary ‘1’ and ‘0’ value, and thus offers a reference for comparison.
A resistance memory device, comprising:
An MRAM memory device, comprising:
A method of reading a resistance array, comprising a plurality of column lines, a plurality of row lines, and plurality of resistance elements each connected to a column and row line:
A method of reading a resistance array, comprising a plurality of column lines, a plurality of row lines, and plurality of resistance elements each connected to a column and row line:
An processor circuit, comprising:
An processor circuit, comprising:
Dependencies are inferred from the claim text.
Drawings are temporarily unavailable. Open the PDF at USPTO
From the US filing history. Foreign family members aren’t listed.
Backward citations are indexed for grants only.
Using magnetic elements: using thin-film elements
Sense amplifiers; Associated circuits , e.g. timing or triggering circuits: differential amplifiers of non-latching type, e.g. comparators,…
Static stores
Term end not estimated
The present invention relates to the field of resistor-based memory circuits. More particularly, it relates to a method for precisely sensing the resistance value of a resistor-based memory cell, for example, a Magnetic Random Access Memory (MRAM) magnetic memory cell.
A resistor-based memory such as a magnetic random access memory (MRAM) typically includes an array of resistor-based magnetic memory cells. The logic state of such a magnetic memory cell is indicated by its resistance. One resistance value, e.g., the higher value, may be used to signify a logic high while another resistance value, e.g., the lower value, may be used to signify a logic low. The value stored in each memory cell can be determined by measuring the resistance value of the cell to determine whether the cell corresponds to a logic high or low. Such direct measurements are often difficult to simply and easily implement and require a number of comparators which increases the cost and size of the memory circuit. A simplified, more reliable method of sensing the resistance value of a resistor-based memory cell is desired.
The present invention provides a simple and reliable method and apparatus for sensing the logic state of a resistor-based memory cell. Resistance is measured by first charging a first capacitor to a predetermined voltage, discharging the first capacitor through a resistance to be measured while discharging a second capacitor through an associated reference resistance of known value and comparing the discharge characteristics e.g. the discharge voltage of two capacitors to determine a value of resistance to be measured relative to the reference resistance.
The foregoing and other features and advantages of the invention will become more apparent from the detailed description of the exemplary embodiments of the invention given below with reference to the accompanying drawings in which:
FIG. 1 shows the invention employed in an exemplary MRAM device;
FIG. 2 shows a schematic diagram of one aspect of the invention;
A portion of a MRAM array 100 with which the present invention may be used is shown in FIG. 1. The logical state of an MRAM memory element e.g. 204 is represented by the resistance of that element. In the present invention, resistance is determined by holding a voltage constant across a cell's resistive element and comparing a voltage produced by the current that flows through that resistive element with a voltage produced by the current flow through a known reference resistance. To read the binary state of a memory cell element, the absolute magnitude of resistance need not be known; only whether the resistance is above or below a value that is intermediate to the logic high and logic low values. Accordingly, to provide a reference current flow for comparison purposes the resistive elements within rightmost column 108 of array 100 are preprogrammed to hold all ‘0’ values, while those within column 110 immediately to its left are preprogrammed to hold all ‘1’ values. The current flowing through these two columns when a particular row line of the array 100 is selected by grounding a rowline, e.g. rowline 120, will heretofore be designated as I0 and I1 as shown in FIG. 1.
During the reading process, all column and row lines are driven with the same array voltage VA, except for the one row line, e.g. 120 that is desired to be read. That row line 120 is driven to ground. When row 120 is grounded, a resistive element of a selected column, e.g. column 109, can be read by a sensing circuit 300 described below As shown in FIG. 1, both ends of all resistive elements not being measured are maintained at the same potential, VA. Thus, unwanted current flow through these resistive elements due to “sneak” resistance is negligible. A current Isense flows through the grounded resistive element of a selected column within the row 120 for allowing measurement of the resistance by the sensing circuit 300 (not shown in FIG. 1).
FIG. 2 shows a circuit 200 for regulating current through and voltage across a resistive element 204 being measured. An operational amplifier 220 has one terminal 222 connected to VA, while the other terminal 224 is connected to the column line 109 for the resistance element 204 which is being sensed. The gate 242 of NMOS transistor 240 is connected to the output of operational amplifier 220. The source 246 of transistor 240 is connected to one terminal of the resistive element 204 being read, while the other terminal of resistive element 204 is driven to ground by the grounding of wordline 120 described earlier. Operational amplifier 220 and transistor 240 act in concert to keep one terminal of resistive element 204 stably at VA despite the fact that the other terminal is grounded. In this way, Isense can flow through transistor 240 and resistive element 204, while current lost through sneak resistor 225 is minimized.