Optimized conductor routing for multiple components on a printed circuit board
AssigneeHewlett-Packard Development Company, L.P.
InventorMelvin Peterson
Life of this patent
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AssigneeHewlett-Packard Development Company, L.P.
InventorMelvin Peterson
Estimating the term…
A multilayered substrate includes a plurality of connection point groups, each including connection points. At least two inside conductors are each electrically coupled to inside connection points in at least two connection point groups, wherein each of the inside conductors is substantially equal in length between the inside connection points of adjacent connection point groups which is defined as a inside conductor length. At least two outside conductors are each electrically coupled to outside connection points in at least two connection point groups, wherein each of the outside conductors is substantially equal in length between the outside connection points of the adjacent connection point groups which is defined as an outside conductor length. The inside conductor length is shorter than the outside conductor length.
A multilayered substrate, comprising:
A printed circuit board, comprising:
A printed circuit board, comprising:
An electronic system, comprising:
A method of routing signals on a printed circuit board, comprising:
Dependencies are inferred from the claim text.