Electrostatic chucking stage and substrate processing apparatus

An electrostatic chucking stage for electro-statically chucking an object, comprising:

• a dielectric plate on which the object is chucked;
• a chucking electrode to which voltage for dielectrically polarizing the dielectric plate is applied;
• a moderation layer that is provided between the dielectric plate and the chucking electrode, and has a thermal expansion coefficient between the dielectric plate and the chucking electrode;
• and
• a covering layer that is provided on the chucking plate at the side opposite to the dielectric plate, and has a thermal expansion coefficient between the dielectric plate and the chucking electrode;
• further comprising the structure where the chucking electrode is sandwiched by the moderation layer and the covering layer;
• wherein
• the dielectric plate is made of alumina,
• the chucking electrode is made of aluminum,
• the moderation layer is made of composite of silicon carbide and aluminum, and
• the dielectric plate and the moderation layer are brazed with brazing material of which main component is indium.