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US 2003/0197573 A1Published application
Multilayer substrate and satellite broadcast reception apparatus
AssigneeSharp Kabushiki Kaisha
InventorMasahiro Kato
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AssigneeSharp Kabushiki Kaisha
InventorMasahiro Kato
Estimating the term…
A multilayer substrate ensuring transmission loss as low as when one double-sided substrate is used, while reducing noise, and an LNB converter are provided. The multilayer substrate includes a four-layer substrate having pattern layers sandwiching dielectric layers therebetween. The surface pattern layer provided with a signal line of the microstrip line has a projecting portion. The pattern layer provided with a ground pattern corresponding to the signal line has a portion at least overlapping a root portion of the projecting portion as seen from the top and constituting a surface layer on the other side opposite to the root portion, with no other pattern layer interposed between the relevant portions.
A satellite broadcast reception apparatus including a multilayer substrate having a microstrip line and a probe and formed of at least three pattern layers with a dielectric layer interposed between every adjacent two of said pattern layers, the apparatus causing a radiowave signal from an antenna to propagate through a waveguide to transmit via said probe to said microstrip line, wherein
A multilayer substrate having a microstrip line and a probe and formed of at least three pattern layers with a dielectric layer interposed between every adjacent two of said pattern layers, wherein
Dependencies are inferred from the claim text.
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For coupling balanced lines or devices with unbalanced lines or devices: hollow-waveguide/strip-line transitions
Waveguides
Term end not estimated
1. Field of the Invention
The present invention relates to a multilayer substrate for use in a satellite broadcast reception apparatus, or a low noise block-down (LNB) converter, employed in satellite broadcasting and satellite communication, and a satellite broadcast reception apparatus (hereinafter, referred to as the “LNB converter”) using the relevant multilayer substrate.
2. Description of the Background Art
FIG. 1 is a cross sectional view of a multilayer substrate used in an LNB converter according to a first embodiment of the present invention.
FIG. 2 is a top plan view of the first pattern layer of the multilayer substrate shown in FIG. 1 in the vicinity of a through hole.
FIG. 3 is a top plan view of the fourth pattern layer of the multilayer substrate shown in FIG. 1 in the vicinity of the through hole.
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
First Embodiment
FIG. 1 is a cross sectional view of the multilayer substrate used in an LNB converter according to the first embodiment of the present invention. This multilayer substrate 10 has two double-sided substrates bonded together by a bonding insulating layer 6. Multilayer substrate 10 is provided with a through hole 21, and a probe 20 is provided to project into through hole 21. Probe 20 is formed of a projecting portion 1a which projects from a first pattern layer 1 provided with a microstrip line, and projecting portions 5a, 7a, 6a which project from two substrate insulating layers 5, 7 and insulating layer 6.