Method for manufacturing quartz crystal resonator, quartz crystal unit and quartz crystal oscillator

A method for manufacturing a quartz crystal unit comprising a contour mode quartz crystal resonator which is one of a width-extensional mode quartz crystal resonator, a length-extensional mode quartz crystal resonator and a Lame mode quartz crystal resonator, a case and a lid, and said contour mode quartz crystal resonator comprising the step of:

• utilizing a particle method or a chemical etching method to form a resonator comprising;
• a vibrational portion;
• connecting portions located at ends of said vibrational portion;
• supporting portions connected to said vibrational portion through said connecting portions;
• and
• electrodes disposed opposite each other on upper and lower faces of said vibrational portion so that the electrodes disposed opposite each other are of opposite electrical polarity,
• wherein a plurality of individual contour mode quartz crystal resonators are formed in a quartz crystal wafer, each of which is capable of vibrating in a contour mode and a single mode,
• and wherein each of said individual contour mode quartz crystal resonators is mounted at a mounting portion of a case, and the resonance frequency of each resonator is adjusted by laser trimming or a plasma etching method so that a frequency deviation is within a range of −100 PPM to +100 PPM to a nominal frequency of less than 135 MHz when the quartz crystal unit is provided.

A method for manufacturing a quartz crystal oscillator comprising:

• a quartz crystal oscillating circuit comprising;
• an amplification circuit comprising an amplifier at least and a feedback circuit comprising a quartz crystal tuning fork resonator and capacitors at least, said quartz crystal tuning fork resonator comprising the steps of:
• forming integrally tuning fork tines each of which has a length, a width and a thickness and the length greater than the width and the thickness, and a tuning fork base;
• providing grooves;
• and
• disposing electrodes inside the grooves and on sides of said tuning fork tines,
• and the grooves being provided at said tuning fork tines, and the electrodes being disposed opposite each other inside the grooves and on the sides of said tuning fork tines so that the electrodes disposed opposite each other are of opposite electrical polarity and said tuning fork tines are capable of vibrating in inverse phase, and said quartz crystal oscillating circuit comprising the step of connecting electrically said quartz crystal tuning fork resonator, the amplifier and the capacitors at least,
• wherein said quartz crystal tuning fork resonator is capable of vibrating in a flexural mode and said quartz crystal oscillating circuit comprises said quartz crystal tuning fork resonator whose figure of merit M1 of a fundamental mode vibration is larger than figure of merit M2 of a second overtone mode vibration to suppress the second overtone mode vibration and to get a high frequency stability for the fundamental mode vibration.

A method for manufacturing a quartz crystal oscillator comprising:

• a quartz crystal oscillating circuit comprising;
• an amplification circuit comprising a CMOS inverter and a feedback resistor, and a feedback circuit comprising a quartz crystal tuning fork resonator capable of vibrating in a flexural mode, resistors and capacitors, said quartz crystal tuning fork resonator comprising the step of:
• utilizing a chemical etching method to form a resonator comprising;
• tuning fork tines each of which has a length, a width and a thickness and the length greater than the width and the thickness, and a tuning fork base, and
• electrodes disposed on obverse and reverse faces and sides of said tuning fork tines so that said tuning fork tines are capable of vibrating in inverse phase, and
• said quartz crystal tuning fork resonator being formed in a quartz crystal wafer and a plurality of individual quartz crystal tuning fork resonators capable of vibrating each in a fundamental mode being formed therein, each of which comprises:
• tuning fork tines and a tuning fork base;
• and electrodes disposed on obverse and reverse faces and sides of the tuning fork tines, and has resonance frequency higher than 32.768 kHz,
• wherein comprising the further steps of:
• forming metal films on the tuning fork tines of the individual quartz crystal tuning fork resonators in the quartz crystal wafer by a spattering method or an evaporation method so as to get the individual quartz crystal tuning fork resonators each of which has resonance frequency of 29.4 kHz to 32.75 kHz;
• mounting each resonator at a mounting portion of a case;
• and after that, adjusting the resonance frequency of the each resonator by laser trimming or a plasma etching method so that it is within a range of 32.764 kHz to 32.772 kHz when a quartz crystal unit comprising said quartz crystal tuning fork resonator is provided,
• wherein said quartz crystal oscillating circuit comprising the amplification circuit and the feedback circuit is constructed so that a ratio of an absolute value of negative resistance, |−RL1| of a fundamental mode vibration of the amplification circuit and series resistance R1 of the fundamental mode vibration is larger than that of an absolute value of negative resistance, |−RL2| of a second overtone mode vibration of the amplification circuit and series resistance R2 of the second overtone mode vibration, and an output signal of said quartz crystal oscillating circuit is outputted through a buffer circuit and has a frequency of 32.764 kHz to 32.772 kHz,
• and wherein comprising the further step of inspecting the individual quartz crystal tuning fork resonators formed in the quartz crystal wafer, and when there is a failure resonator therein, it is removed from the quartz crystal wafer or something is marked on it or it is remembered by a computer.