Test board for testing semiconductor device
AssigneeRenesas Technology Corp.
InventorsDaisuke Ito, Hiroshi Nakagawa, Katsutoshi Ito, Naoyuki Shinonaga, Shinji Senba
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Abstract
There is provided a test board for testing semiconductor devices by connecting a plurality of DUTs (semiconductor devices under the test) with a test head, and transmitting test signals from the test head to the plurality of DUTs. The test board comprises a motherboard connected to the test head; a multi-layer wiring board connected to each of the plurality of DUTS; and a scramble board disposed between the motherboard and the multi-layer wiring board. The mother board and the scramble board, and the multi-layer wiring board and the scramble board are each connected by female connectors and male connectors.
Claims7
A test board for testing semiconductor devices by connecting a plurality of semiconductor devices under the test with a semiconductor test apparatus, and sending test signals from said semiconductor test apparatus to said plurality of semiconductor devices under the test, said test board comprising:
- a first wiring board disposed on said semiconductor test apparatus, and connected to said semiconductor test apparatus;
- a second wiring board connected to each of said plurality of semiconductor devices under the test through contact portions;
- and
- a third wiring board disposed between said first wiring board and said second wiring board;
- wherein
- said first wiring board and said third wiring board, and said second wiring board and said third wiring board are each connected by connectors.
Dependencies are inferred from the claim text.