Semiconductor device low temperature test apparatus using electronic cooling element
AssigneeFujitsu Limited
InventorShigeru Miyakita
Life of this patent
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Abstract
A semiconductor device test apparatus, has: a socket, which connects to a semiconductor device undergoing testing mounted thereon; a test tray, which houses the semiconductor device undergoing testing and which is provided, in a position on which the semiconductor device undergoing testing is mounted, with a first electronic cooling element that absorbs heat via one surface thereof and releases heat via the other surface thereof; and a contact block, which is provided with a second electronic cooling element that makes contact with the top of the semiconductor device undergoing testing in a state in which the semiconductor device undergoing testing is mounted on the socket.
Claims7
A semiconductor device test apparatus, comprising:
- a socket, which connects to a semiconductor device undergoing testing that is mounted on the socket;
- and
- a test tray, which houses the semiconductor device undergoing testing and which is provided, in a position on which the semiconductor device undergoing testing is mounted, with a first electronic cooling element that absorbs heat via one surface thereof and releases heat via the other surface thereof,
- wherein the semiconductor device undergoing testing is housed in the test tray and the bottom side of the semiconductor device undergoing testing is pre-cooled by the first electronic cooling element;
- the test tray is mounted on the socket and a test is implemented while cooling a bottom side of the semiconductor device undergoing testing, which is mounted on the socket, by the first electronic cooling element;
- and, after completion of the test, the semiconductor device undergoing testing is heated by the first electronic cooling element of the test tray.
Dependencies are inferred from the claim text.