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AssigneeFujitsu Limited
InventorsShigeyuki Maruyama, Futoshi Fukaya, Makoto Haseyama
Estimating the term…
A contactor for semiconductor devices includes a base unit for holding a semiconductor device provided with a plurality of terminals and a wiring substrate provided with contact electrodes at positions corresponding to at least some of the terminals. The contact electrodes and the terminals are electrically connected when the wiring substrate is held on the base unit. The contactor further includes a position maintaining force applying mechanism for applying a position maintaining force between the base unit and the wiring substrate and a contact pressure applying mechanism for applying a contact pressure between the semiconductor device and the wiring substrate. The position maintaining force applying mechanism and the contact pressure applying mechanism are operable in an independent manner.
A testing apparatus comprising:
A method of testing a semiconductor device using a contactor for semiconductor devices, said contactor including abase unit for holding a semiconductor device provided with a plurality of terminals and a wiring substrate provided with contact electrodes at positions corresponding to at least some of said terminals, said contact electrodes and said terminals being electrically connected when said wiring substrate is held on said base unit, said contactor further including:
A method of cleaning a contactor for semiconductor devices, particularly cleaning contact electrodes provided on a wiring substrate provided on said contactor, said contactor including a base unit for holding a semiconductor device and a wiring substrate provided with contact electrodes, said contactor further including:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
Backward citations are indexed for grants only.
For supporting or gripping: using vacuum or suction, e.g. Bernoulli chucks
Testing of integrated circuits [IC]: features relating to contacting the IC under test, e.g. probe heads; chucks
Apparatus for manufacture or treatment: apparatus for sealing, encapsulating, glassing, decapsulating or the like
The wafers being placed on a susceptor, stage or support: characterised by edge profile or support profile
Term end not estimated
1. Field of the Invention
The present invention generally relates to a contactor for semiconductor devices, a testing apparatus using such a contactor, a testing method using such a contactor and a method of cleaning such a contactor, and particularly relates to a contactor for obtaining an electrical contact with a semiconductor device such as a wafer, a bare chip, a BGA (Ball Grid Array), an SOP (Small Outline Package) and a QFP (Quad Flat Package), a testing apparatus and a testing method using the contactor, and a method of cleaning such a contactor.
Recently, there is an increasing need for further miniaturized, high-speed and high-density semiconductor devices. Therefore, in order to provide terminals corresponding with such semiconductor devices, efforts are being made to achieve a further fine-pitched structure of the terminals provided on the semiconductor devices. Also, in order to improve the testing efficiency of the semiconductor devices, there is a need for simultaneously contacting a plurality of semiconductor devices, for example, at a wafer level.
FIG. 1 is a cross-sectional diagram showing a contactor of the related art.
FIGS. 2A to 2C are cross-sectional diagrams showing a contactor of a first embodiment of the present invention taken along line I-I in FIG. 3.
FIG. 3 is a plan view showing a base unit constituting the contactor of the first embodiment of the present invention.
In the following, principles and embodiments of the present invention will be described with reference to the accompanying drawings.
FIGS. 2A to 2C and FIG. 3 are cross-sectional diagrams showing a semiconductor device contactor 10A (the semiconductor device contactor is hereinafter simply referred to as a contactor) of a first embodiment of the present invention.
Note that contactors 10A to 10I of the embodiments described later may be applied to any types of semiconductor chip and semiconductor device (hereinafter both are generically referred to as a semiconductor device) such as a wafer, a bare-chip, BGA (Ball Grid Array), an SOP (Small Outline Package) and a QFP (Quad Flat Package). However, in the following description, by way of example, a semiconductor device 20 is described as a wafer.