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AssigneeAmkor Technology, Inc.
InventorsSean Timothy Crowley, Angel Orabuena Alvarez, Jun Young Yang
Estimating the term…
Micro lead frame (MLF)-type semiconductor packages that allow the semiconductor packages to be stacked on top of each other. One aspect of the semiconductor package includes a leadframe, a plurality of electrical connectors, a semiconductor chip, and a sealing material for encapsulating the above components. The leadframe has a plurality of leads, with each one of the plurality of leads running from the top of the semiconductor package to the bottom of the semiconductor package. Each one of the plurality of leads has a top portion protruding from the top surface of the semiconductor package and a bottom portion protruding from the bottom surface of the semiconductor package. The leads allow for electrical connection of a second semiconductor package placed on top of the first semiconductor package. Further, the protruding parts of the leads form a space between the stacked semiconductor packages for improved heat dissipation.
A packaged semiconductor, comprising:
A packaged semiconductor, comprising:
12 The semiconductor package of claim 9 wherein said paddle is etched.
A method for stacking semiconductor packages for semiconductor chips, said method for stacking semiconductor packages comprising the steps of:
A method for manufacturing a semiconductor package for a semiconductor chip, said method for manufacturing a semiconductor package comprising the steps of:
A semiconductor package, comprising:
A lead frame, comprising:
Dependencies are inferred from the claim text.