Reduced stress wire bond
AssigneeLucent Technologies Inc.
InventorEphraim Suhir
Life of this patent
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Abstract
A wire bond comprising an intentionally introduced ends offset wherein the ends offset reduces stress from axial displacement as compared to the same axial displacement on a wire bond without an intentionally introduced ends offset. Further disclosed are a semiconductor device comprising at least one wire bond having an intentionally introduced stress reducing ends offset, and methods for fabricating a wire bond and semiconductor device.
Claims10
A wire bond comprising intentionally introduced ends offset wherein the ends offset reduces stress from axial displacement as compared to the same axial displacement on a wire bond without intentionally introduced ends offset.
A method of fabricating a wire bond wherein the wire bond has two ends, the method comprising:
- intentionally offsetting the ends so that stress from axial displacement is reduced as compared to the same axial displacement on a wire bond without an intentionally introduced ends offset.
A method of fabricating a semiconductor device comprising at least one wire bond wherein the wire bond has two ends, the method comprising:
- intentionally offsetting the ends so that stress from axial displacement is reduced as compared to the same axial displacement on a wire bond without an intentionally introduced ends offset.
Dependencies are inferred from the claim text.